Divisions and Work Packages

Photonics and Optoelectronics

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Photonics and Optoelectronics

The mission of  Work Package Photonics and Optoelectronics is to develop GRM-based components for photonic and optoelectronic applications and to integrate them into photonic circuits, imaging arrays and optical sensors.
​​A key goal is a prototype transceiver bank, consisting of high-speed electro-optical modulators and photodetectors (PDs) integrated in a CMOS-compatible environment. We will also develop broadband PDs for visible, IR and THz, with performances beyond the state of the art. These detectors will be integrated with CMOS electronics for imaging systems, as well as flexible platforms for wearable devices.

Furthermore, we will exploit in-situ controllable plasmons and optical properties for mid-IR and THz PDs, reflect-arrays, isolators and bio- and gas sensors. WP8  will have a specific focus on improving the TRL of the components, to show operation in real world conditions as prototype demonstrators, and further developments on the way to wafer scale integration.

Work Package Leader: Professor Frank Koppens, ICFO, Spain
Work Package Deputy: Professor Andrea Ferrari, University of Cambridge, UK

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Publishing date: 29 March 2017 09:36
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