Work Package Wafer Scale System Integration targets the transition from laboratory to wafer based microfabrication technology within an application roadmap for Photonics, Electronics and Flexible Electronics.
Graphene Flagship has produced a large amount of knowledge, preliminary concepts and devices. Real industrial uptake however requires process scalability to large areas, high quality and reproducible layers and hetero-structures based on graphene and GRM, including functional device demo’s at industrial level.
In this workpackage we will focus on developing solutions and demonstrations for the wafer scale integration of different technologies, including Photonics and Optoelectronics, Electronics and Flexible Electronics on 300/200mm SOI and Si wafers to 150mm SiN or Quartz and even 100mm AlN wafers. The wafer scale developments will be in agreement with applications indicated and developed within the Division Electronics of the Flagship.
Work Package Leader: Marco Romagnoli, CNIT, Italy
Work Package Deputy: Amaia Zurutuza, GSEMI, Spain
01 April 2020 00:00