How We Work

Work Package 1: The goal of this work package is to mature the development of process modules for graphene integration utilising the wafer carrier transfer method established in the 2D-EPL. This work package also supplies wafers to other work packaged for photonics, sensor applications, characterisation and metrology development and external offerings.

Leader: Amaia Zurutuza, Graphenea Semiconductor, Spain

Work Package 2: This work package aims to further mature the TMDC growth, transfer and encapsulation modules for stable device integration (TRL3 à TRL 4/5). The work package also supplies TMDC wafers to the consortium and for external offerings.

Leader: Pierre Morin, IMEC, Belgium 

Work Package 3: This work package will further develop and mature photonic platforms for graphene and TMDC materials in standard 200 mm Si pilot lines at IHP and VTT. The work package will build the foundation for Multi-Project Wafer (MPW) runs within the 2D-PL project

Leader: Mindaugas Lukosius, IHP - Leibniz-Institut für innovative Mikroelektronik, Germany

Work Package 4: This work package will develop and improve wafer scale fabrication of electronic and sensing devices using graphene and TMDCs. This involves achieving residue-free patterning of TMDC and graphene as well as preparing and executing MPW runs for electronics and sensing applications and the creation of PDKs to streamline integration processes.

Leader: Gordon Rinke, AMO, Germany

Work Package 5: This work package will define and verify protocols for chemical, electrical and structural characterisation of the 2D materials (TXRF, Raman, AFM, etc..); develop an automated Raman/PL tool for up to 300 mm wafer in-line metrology; contribute to 2D material standardisation; and utilise Scanning Nitrogen-Vacancy Microscopy (SNVM) to detect low-dimensional defects in 2D materials.

Leader: Miika Soikkeli, VTT Finland

Work Package 6: The goal of this work package is to coordinate the implementation of the 2D-PL service offerings; interaction with the customers to provide access and understand customers' needs; dissemination, communication, training and exploitation activities developed to promote the 2D-PL; roadmapping and market analysis for 2D technologies; and the Industrial Advisory Board (IAB).

Leader: Inge Asselberghs, IMEC, Belgium

Work Package 7: The goal of this work package is to implement the 2D Pilot Line Project in an efficient manner, to plan and coordinate its actions, coordinate its interaction with the Graphene Flagship project, and manage connections within the Graphene Flagship and also stakeholders such as the European Commission.

Leader: Jackie Brown-Bauer, Chalmers University of Technology