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2D-PL multi-project wafer run 4


EU Funded

The 2D-PL's fourth MPW run is mainly intended towards electronics but can also include sensor devices (e.g. Hall sensor, but via opening on graphene is not in the scope of this run) and will be provided by AMO GmbH. The design of the device can be adjusted within the specifications. The offered device structure is a GFET (Fig. 1) consisting of the following fabrication steps:

  • Local Back gate (Au or Pd)
  • Dielectric deposition & vias opening
  • Bottom contacts fabrication (as local BG)
  • Wafer-scale graphene transfer & patterning
  • Encapsulation & vias opening (not on top of graphene)
  • Optional: Au Bondpads

The summary of the key parameters for a device with local back gate is shown in the table below.

Timeline

Application Phase: 17 November 2025 - 29 May 2026

Internal preparation: 1 June 2026 - 31 August 2026

MPW run execution: 1 September – 31 October 2026

Delivery: 1 30 November 2026

  • During the application phase, interested clients can contact us via the contact below and receive further information about the run in a first meeting.
  • Final Layout Submission and PO must be received by 22 June 2026.
  • The chips are expected to be delivered in November 2026.

Pricing

  • 3600€ set price for 8 dies with identical design (1x1 cm²)
  • Each additional die with identical design costs 450€ more
  • 50% discount is possible through the 2D-PL support programme.

 

  Contact us for more information

Figure 1. Scheme with the different layers of the final GFET structure.

Specifications

Substrate

  • Material: Silicon/SiO2 (90nm)
    • Si Resistivity 1-10 Ohm-cm
    • Thickness 675+/-25µm
  • Basic die size: 1 x 1 cm²

Resolution

General design rule: 10 μm for in-layer critical dimension and over-layer alignment

Layer Thicknesses

Characterisation

  • Raman characterisation
  • Electrical measurement for as-fabricated reference devices
  • General optical inspection of your devices

Apply now

Person holding a wafer

Reduced fees

The 2D-PL Support Programme lowers the obstacles for researchers and companies wanting to join our multi-project wafer (MPW) runs. Selected participants can receive a reduction of up to 50% off the MPW fee in exchange for providing feedback on the received devices in the form of a short interview with the hosting pilot line. Your feedback helps us improve future runs. 

2D-PL support programme
Map of Europe with Aachen called out with an image of the AMO building

About AMO

Located in Aachen, Germany, close to the borders of Belgium and the Netherlands, the research foundry AMO GmbH, a non-profit nanotechnology SME, follows the mission to efficiently close the gap between university research and industrial application. It demonstrates innovative technologies and introduces new materials, including their implementation in novel device architectures, prototyping and small volume fabrication. A state-of-the-art 400 m² cleanroom is operated and a range of services from consulting to prototype development is offered. In recent years, AMO has become a global player in 2D materials research for electronics and photonics.

AMO Gmbh
Otto Blumenthal-Str. 25
52074 Aachen
Germany

Email: 2d-PL@amo.de