2D Materials for Future Electronics
Hybrid Session Live Streaming from in-person workshop "2D Materials for Future Electronics"
AMO GmbH, the Aachen Graphene & 2D Materials Center, and RWTH Aachen University will continue their successful series of events dedicated to 2D materials. This year's workshop on “2D Materials for Future Electronics” will take place in person on March 3–4, 2026, in Aachen, Germany, bringing together leading researchers and industry experts to explore the latest advances and future opportunities for electronic applications. The workshop will feature a special hybrid session in collaboration with 2D-PL, which will be live-streamed from 16:50-18:05 on 3 March 2026, allowing remote participants to actively interact with speakers and the in-person audience.
Speakers
Gordon Rinke
AMO
Inge Asselberghs
imec
Miika Soikkeli
VTT
Nadine Collaert
imec
Introduction
Inge Asselberghs, imec
2D-PL Multi Project Wafer runs
Gordon Rinke, AMO
2D Material Integration on Si CMOS Back-End-of-Line for Sensors
Miika Soikkeli, VTT
Abstract: 2D material Si CMOS back-end-of-line integration can enable novel sensor solutions for several application areas such as biosensors, IR cameras, gas sensors and pressure sensors. The latest developments in 2D-PL project related to the processing, metrology, process design kit (PDK) and use cases from customers will be presented.
The Good, The Bad, and The MX2: Benchmarking 2D Materials Against the Semiconductor Giants
Nadine Collaert, imec
Abstract: 2D materials like MX2 offer transformative potential for logic, memory, RF and optical applications and even beyond that, due to their exceptional electrostatic control and carrier mobility. However, the path to commercial compute and connectivity is blocked by entrenched incumbents: silicon FinFET, GAA, and CFET architectures, alongside III-V devices, emerging optical technologies and 3D integration techniques. This presentation evaluates the competitive gap, identifying the "ugly" realities of large-scale synthesis, contact resistance, gate stack, and thermal management. By benchmarking 2D performance against current industry roadmaps, we define the critical milestones required for these atomic-scale layers to transition from laboratory curiosities to indispensable components in the global semiconductor ecosystem.
