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2D-PL @ ECOC 2026

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Malaga, Spain
20-24 September
PDK training
2D-PL PDKs
2D-PL MPW runs
  • Malaga, Spain
  • 20-24 September

Unlock new possibilities in photonics with graphene

The 2D Pilot Line (2D-PL) is bringing graphene-based photonics closer to industrial adoption. By integrating graphene with established silicon photonics platforms and developing processes in fab-relevant environments, the 2D-PL enables industry and researchers to explore new approaches to high-speed, tunable and compact photonic devices—at wafer scale. Come learn about the project's latest offerings at ECOC, to beheld in Malaga, Spain, on 20-24 September 2026.

From the 2D-PL

200mm wafer with graphene PICs

This wafer, fabricated in IHP’s pilot line, contains 77 individual chips (11 . 7), separated by horizontal and vertical lines that can be seen such that each chip can later be cut out and used independently. Each chip contains approximately 630 optical and electrical test structures, giving ~48,500 structures on a single wafer. Across this tiny area, we fabricate waveguides, grating couplers, Hall bars, modulators and many other structures for applications as phonics integrated circuits. Producing tens of thousands of such structures on one wafer—and potentially millions across multiple wafers— demonstrates how 2D-material technology can move from laboratory scale devices toward large-scale manufacturing.

Graphene integration on SiN waveguide platform

VTT’s 200 nm thick SiN waveguide wafer features integrated graphene photodetectors. The detectors are integrated on shallow rib waveguides and coupling is enabled using grating couplers. The wafer also includes optical and electrical test structures for fabrication quality monitoring. After its cleanroom conversion in autumn 2025, VTT shifted its graphene device development to 200 mm wafers.

Process design kits

2D-PL Process Design Kits (PDKs) give you the building blocks, design rules and device models you need to turn innovative 2D material concepts into solid IC designs, to simulate physical data and realistic performances of next-generation devices. 

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