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Integration workflows for 2D material-based devices

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2 November 2026
  • Online
  • 2 November 2026

Integration workflows for 2D material-based devices


This seminar will provide a comprehensive overview of the integration workflows adopted by the 2D Pilot Line’s host partners for the fabrication of 2D materials-based electronics and photonics devices. Experts from Graphenea, AMO GmbH, imec, IHP and VTT will illustrate how their facilities enable 2D materials integration by shedding light on the complete device lifecycle, from design conception and CAD implementation to tape-out file creation and testing. Particular focus will be dedicated to graphene photonic devices, manufactured in two 200 mm CMOS-compatible pilot lines, and their key processing stages, such as growth, passivation and contacting. Beyond the device fabrication itself, partners will delve into the development of dedicated process design kits (PDKs) and the implementation of the multi-project wafer (MPW) approach, essential for enabling the systematic design and scalable integration of 2DM-based devices within a foundry-compatible platform.

Speakers

Inge Asselberghs

Inge Asselberghs


imec

Elias Torres – GSEMI

Elias Torres


Graphenea Semiconductors

Gordon Rinke – AMO GmbH

Gordon Rinke


AMO GmbH

Quentin Smets – IMEC

Quentin Smets


imec

Mindaugas Lukosius – IHP

Mindaugas Lukosius


IHP

Olli-Pekka Kilpi – VTT

Olli-Pekka Kilpi


VTT

09:00 09:00 - 09:10

Introduction to the 2D Pilot Line

Inge Asselberghs, imec 

09:10 09:10 - 09:50

Introduction to Europractice

Natalia Belova, imec 

09:20 09:20 - 09:45

Wafer-scale graphene devices for biosensing

Elias Torres, Graphenea Semiconductors

This presentation provides a comprehensive overview of Graphenea’s Process Flow 2 and its associated Process Design Kit (PDK), tailored for realising graphene-based biosensing devices. We will trace the complete device lifecycle—spanning design conception, CAD implementation, tape-out and testing—highlighting the integration of open-source software throughout the workflow. Additionally, the talk examines critical packaging and integration challenges inherent to cutting-edge biosensing and liquid biopsy platforms. Through a curated review of practical examples from recent literature, we will compare varying implementation strategies. This session is specifically designed for researchers and engineers seeking to optimise or initiate the development of advanced graphene-based biosensors. 

09:45 09:45 - 10:10

Enabling Research and Innovation in Graphene and 2D Materials Through Integrated Device Fabrication Workflows and Foundry Services.

Gordon Rinke, AMO GmbH 

The presentation will provide an overview of the 2D Pilot Line integration approach, including how graphene and other 2D materials can be incorporated into established semiconductor process flows. It will explain what the workflow looks like in practice, from design and process preparation through Multi-Project Wafer (MPW) runs, while highlighting the opportunities for users to customise their designs and explore different device concepts.

The talk will also introduce how researchers and companies can access these capabilities through the 2D Pilot Line’s MPW offerings, including the role of Process Design Kits (PDKs) in enabling users to design 2D-material-based devices within a familiar semiconductor design workflow. Finally, examples from successful users—including work from Belfast, KAUST and Granada—will demonstrate how the platform is being used to translate 2D-material integration into functional devices and publishable research results.

10:10 10:10 - 10:40

Coffee break

10:40 10:40 - 11:05

Title TBA

Quentin Smets, imec  

11:05 11:05 - 11:30

Graphene photonic integrated circuits in 200 mm pilot line

Mindaugas Lukosius, IHP  

This talk will focus on a comprehensive examination of the design, integration and performance of graphene photonic devices on SiN waveguides, which were manufactured using a 200 mm pilot line. In the context of fabricating graphene-based components within a 200-mm CMOS-compatible Si environment, several processing stages – namely, growth, passivation and contacting – emerge as being of paramount importance. Beyond the device fabrication itself, the development of a dedicated process design kit (PDK) and the implementation of a multi-project wafer (MPW) approach are essential for enabling the systematic design and scalable integration of graphene photonic devices within a foundry-compatible platform. 

11:30 11:30 - 11:55

Graphene Integration on a SiN Integrated Photonics Platform

Olli-Pekka Kilpi, VTT  

This presentation introduces the integration of graphene modulators on a 200 mm SiN integrated photonics platform. The SiN platform is designed for broadband operation and incorporates the essential passive photonic building blocks. To enable high-quality 2D material integration, the platform features low surface topography and roughness, helping to preserve the properties of transferred graphene. The presentation covers the development and characterization of graphene modulators, together with an introduction to the process design kit.