Integration workflows for 2D material-based devices
Integration workflows for 2D material-based devices
This seminar will provide a comprehensive overview of the integration workflows adopted by the 2D Pilot Line’s host partners for the fabrication of 2D materials-based electronics and photonics devices. Experts from Graphenea, AMO GmbH, imec, IHP and VTT will illustrate how their facilities enable 2D materials integration by shedding light on the complete device lifecycle, from design conception and CAD implementation to tape-out file creation and testing. Particular focus will be dedicated to graphene photonic devices, manufactured in two 200 mm CMOS-compatible pilot lines, and their key processing stages, such as growth, passivation and contacting. Beyond the device fabrication itself, partners will delve into the development of dedicated process design kits (PDKs) and the implementation of the multi-project wafer (MPW) approach, essential for enabling the systematic design and scalable integration of 2DM-based devices within a foundry-compatible platform.