2D Pilot Line Showcases Next-Gen Semiconductor Integration at SEMICON Europa

The 2D-PL aims to enable wafer-scale integration of materials such as graphene and transition metal dichalcogenides (TMDCs) into conventional silicon-based semiconductor platforms. The project offers end-to-end prototyping services — from material growth and transfer to full device integration, metrology and application testing — all in a “FAB-relevant” environment to match industrial semiconductor manufacturing standards.

At the exhibition, the 2D-PL showcased several of the technological building blocks that make this integration possible:

• Wafers demonstrating the growth and transfer of graphene on copper as well as germanium-on-silicon substrates with uniform monolayer graphene — designed for compatibility with existing CMOS manufacturing processes. 

• The use of advanced deposition technology: for example, AIXTRON’s Close-Coupled Showerhead (CCS) system for high-quality TMDC monolayer growth on 300 mm wafers — showing that 2DM fabrication can scale toward industrial levels.

• Automated wafer bonding and transfer via tools such as the EVG wafer-bonding system and a mechanical debonding platform (SUSS MicroTec XBC300 Gen2), enabling 2D-material transfer up to 300 mm wafers. 

• Demonstration wafers with graphene-based electronic test structures (e.g., Hall bars, TLM patterns) across full wafers, enabling uniformity and reliability testing at scale. 

• A full description of the demos exhibited can be found here. 

These demonstrations mark important progress in overcoming some of the long-standing barriers to industrial use of 2D materials. By embedding these materials into mainstream semiconductor workflows, the 2D-PL may pave the way for next-generation electronics, photonics and sensor technologies that leverage the unique electrical, optical, and physical properties of 2D materials.

Multi-Project Wafers — Lower Barriers for Innovation

An important feature of 2D-PL is its multi-project wafer run (MPW) offerings. These allow multiple customer designs — whether from SMEs, research centres, startups or large companies — to be pooled on a shared wafer run, sharing mask costs and accelerating prototyping. 

At SEMICON Europa, 2D-PL representatives highlighted four active MPW offerings, targeting:

• CMOS devices

• Photonics applications

• Biosensors

They also reiterated that participants can currently participate in the project's support programme offering a 50% reduction in fees for customers willing to provide extended feedback on their devices, helping the 2D-PL refine and optimise its processes.

This business-model approach aims to lower entry barriers for smaller players, democratising access to advanced 2DM fabrication without large upfront investments — thereby fostering broader innovation across the semiconductor ecosystem.

The 2D-PL booth was also proud to welcome the Executive Director of the European Union’s Chips Joint Undertaking and former director of the Graphene Flagship Jari Kinaret and Frank Holsteyns, VP R&D Unit Process & Modules at imec. Inge Asselberghs, coordinator for both the 2D-PL and the Chips JU-funded NanoIC pilot line, presented the latest technical developments and synergies between the pilot lines, including their impact on the transition from lab to fab, the development of application driven integration flows and access to novel technology.

“Semicon Europa has been the perfect opportunity for us to meet and learn about their experience with the challenges of bringing lab-ready concepts to fab-compatible demonstrators,” explained Jari Kinaret.

Specifically, the 2D-PL's innovations lead to 2D-materials integration capabilities on CMOS compatible process and tools, including semiconducting TMDC, Graphene Field Effect Transistors (GFETs) and graphene-based Photonic Integrated Circuits (PICs). These innovations have the potential to connect to NanoIC’s key technologies.

Together, these two pilot lines contribute to a shared European mission: enabling cutting-edge semiconductor innovation through open-access platforms.

The 2D-PL presence at SEMICON Europa 2025 highlighted a pivotal moment for the project. Through industrial-grade processes, multi-project wafer runs and a collaborative ecosystem bridging academia, SMEs and larger industry, 2D-PL is charting a course for the next wave of European electronics innovation.