Work Package 7
We research and develop new foundations for the fabrication processes and applications of devices and integrated circuits to be used in future electronic systems. The main focus of the Electronic Devices Work Package is on wireless communications systems, logic circuits for data processing and storage, and flexible electronics.
We are particularly interested in using graphene for radio frequency devices for wireless communication, and transition metal dichalcogenindes for logic devices in programmable circuits.
Our research will have an impact on future communication technologies, which require devices that operate at higher frequencies and with a higher data transfer rate. We will drive forward new developments in quantum and neuromorphic computation.
Breaking into the field
We developed several prototypes and working demonstrations that showcase the excellent performance of electronic devices based on graphene and layered materials. This includes flexible radio frequency devices circuits, new logic circuits, or receivers that operate beyond 100 GHz, which are key for new highfrequency, long-range communication technology.
We also developed solutions for critical steps in the fabrication process for electronic, photonic and sensor devices that have previously been a challenge to scientists. These have now been upscaled to be viable for manufacturing in an industrially relevant environment. For example, we developed a method to introduce low-ohmic contacts to graphene, and a method to encapsulate layers of graphene or layered materials to enable long-term stability
The half-day-long online event connected industrial players in the field of electronics and encouraged new collaborations using graphene
Funded by the European Commission, this €20 million project will enable large volume production of electronic devices based on two-dimensional materials.
Graphene Flagship Business Developer for Electronics Applications, Lilei Ye, offers her thoughts on the current state of of graphene in the field
Graphene Flagship partnering project GraNiTe exploited graphene and layered materials to enhance transistors for communications, diagnostics and security
Payper worked with the Graphene Flagship to develop a new contactless payment method using printable circuits